Lunyu Ma: search on Z-Library

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1

Development of G-Helix Structure as Off-Chip Interconnect

Zhu, Qi, Ma, Lunyu, Sitaraman, Suresh K.

Journal:

Journal of Electronic Packaging

Year:

2004

Language:

english

File:

PDF, 527 KB

english, 2004

2

Synthesis of Manganese Oxide Hollow Urchins with a Reactive Template of Carbon Spheres

Nan Wang, Yu Gao, Jian Gong, Xinyan Ma, Xiaoli Zhang, Yihang Guo, Lunyu Qu

Journal:

European Journal of Inorganic Chemistry

Year:

2008

Language:

english

File:

PDF, 757 KB

english, 2008

3

β-Helix: A lithography-based compliant off-chip interconnect

Qi Zhu,, Lunyu Ma,, Sitaraman, S.K.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 1.24 MB

english, 2003

4

Performance of GLASS and MODIS Satellite Albedo Products in Diagnosing Albedo Variations during Different Time Scales and Special Weather Conditions in the Tibetan Plateau

An, Yingying, Meng, Xianhong, Zhao, Lin, Li, Zhaoguo, Wang, Shaoying, Shang, Lunyu, Chen, Hao, Lyu, Shihua, Li, Guangwei, Ma, Yingsai

Journal:

Year:

2020

File:

PDF, 5.10 MB

2020

5

Determination of kinetic parameters of inorganic metalporphyrins

Lunyu Qu, Ronghua Ma, Yaguang Chen, Yu Chen, Chuntao Liu

Journal:

Journal of Thermal Analysis and Calorimetry

Year:

1995

Language:

english

File:

PDF, 466 KB

english, 1995

6

[IEEE International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (11-14 March 2001)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) - Novel nanospring interconnects for high-density applications

Lunyu Ma,, Qi Zhu,, Sitaraman, S.K., Chua, C., Fork, D.K.

Year:

2001

Language:

english

File:

PDF, 739 KB

english, 2001

7

[IEEE 51st Electronic Components and Technology Conference 2001. Proceedings - Orlando, FL, USA (29 May-1 June 2001)] 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Compliant cantilevered spring interconnects for flip-chip packaging

Lunyu Ma,, Qi Zhu,, Sitaraman, S.K., Chua, C., Fork, D.K.

Year:

2001

Language:

english

File:

PDF, 265 KB

english, 2001

8

[IEEE ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - San Diego, CA, USA (30 May-1 June 2002)] ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) - Design optimization of One-Turn Helix - a novel compliant off-chip interconnect

Qi Zhu,, Lunyu Ma,, Sitaraman, S.K.

Year:

2002

Language:

english

File:

PDF, 515 KB

english, 2002

9

[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Design and optimization of a novel compliant off-chip interconnect One-Turn Helix

Qi Zhu,, Lunyu Ma,, Sitaraman, S.K.

Year:

2002

Language:

english

File:

PDF, 470 KB

english, 2002

10

[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - J-Springs - innovative compliant interconnects for next-generation packaging

Lunyu Ma,, Qi Zhu,, Hantschel, T., Fork, D.K., Sitaraman, S.K.

Year:

2002

Language:

english

File:

PDF, 994 KB

english, 2002

11

Design optimization of one-turn helix: A novel compliant off-chip interconnect

Qi Zhu, Lunyu Ma, S. Sitaraman

Year:

2003

Language:

english

File:

PDF, 814 KB

english, 2003

12

[ASME ASME 2003 International Mechanical Engineering Congress and Exposition - Washington, DC, USA (November 15–21, 2003)] Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology - Three-Mask Fabrication and Optimized Design of First-Level Free-Standing Interconnect for Microelectronics Application

Zhu, Qi, Ma, Lunyu, Lo, George, Sitaraman, Suresh K.

Year:

2003

Language:

english

File:

PDF, 1.03 MB

english, 2003